1 - Assembling and inspection technologies
1.1 - Introduction to the course
The objective of the course “Assembling and Inspection Technologies” is to deepen the knowledge of students in the field assembly and inspection technologies of electronics products based on the course of “Technology of Electronics Products”. The course deals with the steps of reflow soldering technology in details. Stencil manufacturing technologies, stencil design guidelines are also be included. In the aspect of automated soldering, heat transportation method for reflow soldering, thermal profiling for reflow- and wave soldering, and troubleshooting for reflow- and wave soldering failures are discussed. Lastly, insight into inspection techniques (AOI – automated optical inspection, X-ray inspection) and into test techniques (ICT – in-circuit test and FP – flying probe test) is given
BSc and MSc students with knowledge of physics, material science, electronics, technology of electronics products
- Knowledge: the students will have deep knowledge in the field assembly and inspection technologies of electronics products based on the course of “Technology of Electronics Products”. The course deals with the common steps of automated, mass soldering technologies (reflow- and wave soldering) in details, and gives a brief insight into inspection and test methods applied during the manufacturing of electronic products.
- Skills: the students will be capable to fully control the different process steps of automated soldering technologies, to plan testing strategies and to develop inspection algorithms for aiding the defect-free manufacturing of electronic products.
- Competences: the acquired competences allow the students to analyse in-manufacturing defects and failures and to provide solutions for eliminating those defects which are closely related to the automated manufacturing of electronic products. Consequently, the students can also use their obtained skills to effectively reduce failure costs in production.
Budapest University of Technology and Economics, Department of Electronics Technology