2 - Technologies

HexSil is one of the microreplication techniques. A silicon stamp (negative pattern) is used for making released micromechanical structures. First, the stamp is prepared by etching the pattern, and growing silicon dioxide as sacrificial layer. Polysilicon, deposited into the grooves of the stamp will build the base of micromechanical structures. After depositing and structuring copper soldering pads, the top part of polysilicon and the sacrificial layer will be removed. The micromechanical structures is almost released, but held by the stamp. In the next step this complex stamp is soldered onto the substrate, and the stamp is removed, cracking the poly-Si anchors. The micromechanical structures is now released.