Dresden University of Technology
Department of Electrical Engineering and Information Technology - Electronics Packaging Laboratory (IAVT)
http://www.avt.et.tu-dresden.de/en/institution/
Helmholtzstr. 10, Dresden, D-01069, Germany
Prof. Klaus-Jürgen Wolter
wolter(at)avt.et.tu-dresden.de
The TU Dresden is one of eleven German universities that were identified as an “excellence university”. TUD has about 37.000 students, 4.400 publicly funded staff members – among them over 500 professors – and approximately 3.500 externally funded staff members, and, thus, is the largest university in Saxony, today. Having been committed to sciences and the engineering before the reunification of Germany, TU Dresden now is a multi-discipline university, also offering humanities and social sciences as well as medicine.
The Electronic Packaging Laboratory (German abbreviation: IAVT) and the Center of Microtechnical Manufacturing (German abbreviation: ZmP) are working together for more than 10 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.
A unique selling point of IAVT/ZmP is the comprehensive consideration of Electronic Packaging as a unified whole of procedure and process technologies and the additional regarding of product process specific topics. Electronics packaging influences decisively the functional properties, the reliability and the costs of the whole electronic system. The drivers of this progression are the trends in system integration: Reduction of dimensions and volumes; Increasing the number of functions and the switching frequencies; Reduction of costs
The fields of activity of IAVT/ZmP cover a wide range from bio-compatible packaging, different substrate and assembling technologies (organic substrates, thick film and LTCC substrates, micro assembling technologies, surface mount technology, conductive and non-conductive adhesives, optical interconnects etc.), process development and reliability investigations on to destructive and non-destructive testing in electronics production. Topics like quality management and process simulation and optimization complete this. Object of the research work is the comparison, analysis and selection of suitable technologies and materials to ensure reliable packaging as well as the development, diagnostic and reliability evaluation of new packaging technologies.
http://www.avt.et.tu-dresden.de/en/institution/
Helmholtzstr. 10, Dresden, D-01069, Germany
Prof. Klaus-Jürgen Wolter
wolter(at)avt.et.tu-dresden.de
The TU Dresden is one of eleven German universities that were identified as an “excellence university”. TUD has about 37.000 students, 4.400 publicly funded staff members – among them over 500 professors – and approximately 3.500 externally funded staff members, and, thus, is the largest university in Saxony, today. Having been committed to sciences and the engineering before the reunification of Germany, TU Dresden now is a multi-discipline university, also offering humanities and social sciences as well as medicine.
The Electronic Packaging Laboratory (German abbreviation: IAVT) and the Center of Microtechnical Manufacturing (German abbreviation: ZmP) are working together for more than 10 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.
A unique selling point of IAVT/ZmP is the comprehensive consideration of Electronic Packaging as a unified whole of procedure and process technologies and the additional regarding of product process specific topics. Electronics packaging influences decisively the functional properties, the reliability and the costs of the whole electronic system. The drivers of this progression are the trends in system integration: Reduction of dimensions and volumes; Increasing the number of functions and the switching frequencies; Reduction of costs
The fields of activity of IAVT/ZmP cover a wide range from bio-compatible packaging, different substrate and assembling technologies (organic substrates, thick film and LTCC substrates, micro assembling technologies, surface mount technology, conductive and non-conductive adhesives, optical interconnects etc.), process development and reliability investigations on to destructive and non-destructive testing in electronics production. Topics like quality management and process simulation and optimization complete this. Object of the research work is the comparison, analysis and selection of suitable technologies and materials to ensure reliable packaging as well as the development, diagnostic and reliability evaluation of new packaging technologies.