Thick Films, MCM-D   |   Assembly and Joining   |   Assembly and Packaging   |   CAD in Electronics   |   Ceramic Multichip Modules   | Complex Quality Control   |   Interconnection and Joining   |   Laser Processing   |   PCB/MCM Layout Design   |   PWB Technology   | Quality Management   |   Sensor Technologies   |   Packaging Simulation   |   Thick Film Circuits   |   Thermal Management   |  Embedded Systems and Signal Integrity  |  Design and simulation of IC circuits