For the second time Prof. Nicolics, Applied Electronic Materials Group of the Institute of Sensors and Actuators, Vienna University of Technology, invited to attend a Spring Seminar in Austria. Under his excellent organizational and scientific leadership the "28th International Spring Seminar on Electronics Technology" took place from May 19th to 22nd, 2005, focused on "European Electronic Packaging Network", in conjunction with the "8th International Academic Conference on Electronic Packaging Education and Training" (May 18th and 19th , 2005) in Hotel Corvinus, Wiener Neustadt.

102 Professors, young scientists and students were active in this conference and discussed about the following topics:

• Novel electronic materials, nano-materials
• New packaging concepts and sensor applications
• Lead-free soldering
• Innovative electronic materials, reliability physics, thermal management
• Thick film technology and applications
• Printed circuit board technology, circuit design and electromagnetic compatibility
• Manufacturing process and process simulation
• Innovative packaging concepts
• Quality assurance and environmental issues

The seminar attracted participants from 15 nations, and the scientific level of the 24 oral presentations and the 65 poster presentations was very high. The International Steering Committee evaluated all papers and awarded 9 contributions. In the proceedings (237 pages) were published 89 papers as a two-pages abstract each. The full-size papers were published in an electronic matter as a conference CD. This Seminar was supported by seven sponsors.

The Steering Committee has admitted four new members: Prof. Bailey, Greenwich University, UK, Prof. Winkler, Ilmenau University of Technology. Germany, Prof. Szendiuch, Brno University of Technology, Czech Republic, and Prof. Kalita, Rzeszow University of Technology, Poland.