From May 13th to 16th, 2004, Prof. Philippov, Sofia University of Technology, organized the "27th International Spring Seminar on Electronics Technology" in Bankya, Bulgaria, with the main subject "Meeting the Challenges of Electronics Technology Progress" with the "focus on the field of electronics packaging within the broader scope of microelectronics technology".

The organizer defined this topic in his call for papers as follows: "Electronics packaging is the multidisciplinary field that in principle covers all aspects of electronics systems integration starting from the bare silicon die. On a more practical "first" level, it covers the electrical, mechanical, and thermal design of the single or multi-chip package that supports and protect the chip, and provides electrical interconnection to other such packages. At the second level, it includes the multi-disciplinary design of the boards and systems on which such chips or first-level packages are assembled". This view to the complexity of electronics technology was more and more accepted during the last years.

115 participants from 10 nations presented 34 oral papers and 88 posters. 8 presentations were awarded.

This year's proceedings contained the abstracts of the presented papers only (144 abstracts, 80 pages).

Meanwhile the International Steering Committee under the chairmanship of Prof. Wolter consisted of 21 members from 11 nations.